Bambu Lab Patent Filing Proposes a Channelled Heatbed to Improve Adhesion
Bambu Lab’s parent company has filed a heatbed design that routes a heating element through a recess, aiming for more even heat and better adhesion.
The latest news from the world of 3D printing.
Bambu Lab’s parent company has filed a heatbed design that routes a heating element through a recess, aiming for more even heat and better adhesion.
Virginia Tech researchers used extrusion to align liquid metal droplets in silicone, achieving directional thermal conductivity about 40 times higher.
A September 2026 jury verdict targeted Bambu Lab’s X1, P1 and A1 printers, while other patent claims produced mixed results.
Snapmaker’s Series B funding, reported in December 2025, targeted hardware R&D, AI software and ecosystem development after the U1’s Kickstarter success.
The Snapmaker U1 swaps tool heads instead of filament for multicolor printing, with four nozzles, a $999 retail price and a separately sold top cover.
In May 2023, BigTreeTech’s BTT Pi v1.2 paired a $33 price with Klipper support, an accelerometer port and printer-friendly power options.
BigTreeTech’s CB1 arrived in 2022 with a CM4-sized footprint, an Allwinner processor and software documentation covering Klipper setups.
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